thermal bonding

См. также в других словарях:

• Thermal resistance in electronics — Thermal resistance is the temperature difference across a structure when a unit of heat energy flows through it in unit time. It is the reciprocal of thermal conductance. The SI units of thermal resistance are kelvins per watt, or the equivalent… …   Wikipedia

• Thermal spraying — techniques are coating processes in which melted (or heated) materials are sprayed onto a surface. The feedstock (coating precursor) is heated by electrical (plasma or arc) or chemical means (combustion flame). Thermal spraying can provide thick… …   Wikipedia

• Thermal conduction — In heat transfer, conduction (or heat conduction) is a mode of transfer of energy within and between bodies of matter, due to a temperature gradient. Conduction means collisional and diffusive transfer of kinetic energy of particles of ponderable …   Wikipedia

• thermal expansion — Increase in volume of a material as its temperature is increased, usually expressed as a fractional change in dimensions per unit temperature change. When the material is a solid, thermal expansion is usually described in terms of change in… …   Universalium

• thermal-pulse bonding — šiluminis impulsinis suvirinimas statusas T sritis radioelektronika atitikmenys: angl. thermal pulse bonding vok. Wärmeimpulsschweißen, n rus. термоимпульсная сварка, f pranc. soudage thermique par impulsions, m …   Radioelektronikos terminų žodynas

• Direct bonding — describes a wafer bonding process without any additional intermediate layers. The bonding process is based on chemical bonds between two surfaces of any material possible meeting numerous requirements.[1] These requirements are specified for the… …   Wikipedia

• chemical bonding — ▪ chemistry Introduction       any of the interactions that account for the association of atoms into molecules, ions, crystals, and other stable species that make up the familiar substances of the everyday world. When atoms approach one another …   Universalium

• Space Shuttle thermal protection system — The Space Shuttle thermal protection system (TPS) is the barrier that protects the Space Shuttle Orbiter during the searing 1650 °C (3000 °F) heat of atmospheric reentry. A secondary goal is to protect from the heat and cold of space while on… …   Wikipedia

• aluminum wire thermal-compression bonding — termokompresinis aliumininės vielos privirinimas statusas T sritis radioelektronika atitikmenys: angl. aluminum wire thermal compression bonding vok. Aluminiumdrahtbonden, n rus. термокомпрессионная сварка алюминиевой проволоки, f pranc. soudage… …   Radioelektronikos terminų žodynas

• outer-lead thermal-compression bonding — termokompresinis išorinių išvadų prijungimas statusas T sritis radioelektronika atitikmenys: angl. outer lead thermal compression bonding vok. Außenbonden, n rus. термокомпрессионное присоединение внешних выводов, n pranc. connexion à… …   Radioelektronikos terminų žodynas

• Nonwoven fabric — Felt: a non woven cloth Nonwoven fabric is a fabric like material made from long fibres, bonded together by chemical, mechanical, heat or solvent treatment. The term is used in the textile manufacturing industry to denote fabrics, such as felt,… …   Wikipedia